Dr. Chi Zhang received her B.S. with honors in Micro-Electro-Mechanical Systems (MEMS) from Tsinghua University in 2013. She received her doctorate degree in Mechanical Engineering at Stanford University under the advisement of Professor Kenneth Goodson in 2019. Her research interests lie in developing inter- and intra-chip thermal management solutions for heterogeneous integration. She has co-authored over 30 peer-reviewed papers and 10 patents.