专注研究模拟及混合信号集成电路设计技术，包括低噪声模拟前端芯片、高性能红外焦平面读出电路芯片等。承担国家级项目十项，发表第一作者/通讯作者论文100余篇，获发明专利授权50余项，获集成电路布图设计专有权30余项，多款芯片已装备应用，获省部级科研/教学奖励3项，入选国家级高层次科技创新领军人才。
部分论文列表
[1] "6.6 A 320×256 6.9mW 2.2mK-NETD 120.4dB-DR LW-IRFPA with Pixel-Paralleled Light-Driven 20b Current-to-Phase ADC," 2025 IEEE International Solid-State Circuits Conference (ISSCC) , San Francisco, CA, USA, 2025, pp. 124-126, doi: 10.1109/ISSCC49661.2025.10904685.
[2] "A High-Voltage-Compliant 86% Peak Efficiency Current-Mode Stimulator With Dynamic Voltage Supply for Implantable Medical Devices," in IEEE Journal of Solid-State Circuits (JSSC) , doi: 10.1109/JSSC.2024.3505059.
[3] "An Event-Driven Motion Perception ROIC for Cryogenic Infrared Focal Plane Arrays," in IEEE Sensors Journal , doi: 10.1109/JSEN.2025.3574728.
[4] "An Energy-Efficient Four-Channel Interface ASIC for IRFPAs With Optimized Resistor-Sharing Technique Achieving 88.1-dB SNDR," in IEEE Transactions on Very Large Scale Integration (VLSI) Systems , doi: 10.1109/TVLSI.2025.3563503.
[5] "An Energy-Efficient Low-Noise Neural Recording Circuit With Multi-Sampling SAR ADC," in IEEE Transactions on Circuits and Systems II: Express Briefs , vol. 71, no. 12, pp. 4789-4793, Dec. 2024, doi: 10.1109/TCSII.2024.3418991.
[6] "An Interface Chip for Atomic Sensor With Highly Integration Using Multi-Voltage Reference," in IEEE Transactions on Circuits and Systems II: Express Briefs , vol. 71, no. 6, pp. 2981-2985, June 2024, doi: 10.1109/TCSII.2024.3357195.
[7] "A 12-μm Pixel Pitch 640×512 Resolution 120°C Operating Range TEC-Less Bolometric Infrared Imager With Ultra Low Responsivity Drift," in IEEE Transactions on Circuits and Systems II: Express Briefs , vol. 71, no. 3, pp. 1072-1076, March 2024, doi: 10.1109/TCSII.2023.3320171.
[8] "A Low-Power DROIC With Extended-Counting ADC for Uncooled Infrared Silicon Diode Detectors," in IEEE Transactions on Circuits and Systems II: Express Briefs , vol. 70, no. 6, pp. 1881-1885, June 2023, doi: 10.1109/TCSII.2022.3231427.
[9] "A Sub-1ppm/°C Current-Mode CMOS Bandgap Reference With Piecewise Curvature Compensation," in IEEE Transactions on Circuits and Systems I: Regular Papers , vol. 65, no. 3, pp. 904-913, March 2018, doi: 10.1109/TCSI.2017.2771801.
[10] "A High-Voltage Closed-Loop SC Interface for a ±50g Capacitive Micro-Accelerometer With 112.4 dB Dynamic Range," in IEEE Transactions on Circuits and Systems I: Regular Papers , vol. 64, no. 6, pp. 1328-1341, June 2017, doi: 10.1109/TCSI.2016.2645639.
